RW-E6250 Rework station
Code: Talon RW-E6250 Rework Station
RW-E6250 Rework station

Product Description

Talon RW-E6250 Rework Station.


Upper heater: hot-air 1000W                                    Lower heater: hot-air& infrared 1000W     

Bottom IR heater: 6000W                                         Power supply: single-phase 220V,50/60Hz, 6KW

Workable PCB dimension: 20x20~450x400mm        Workable PCB thickness: 0.5mm ~ 4mm           

Workable BGA dimension: 1x1mm ~ 70x70mm        Air supply: 5~8kgf/cm2,60L/min

Min pitch of BGA ball:  0.15mm                                Placement precision:0.01mm 

Max. BGA weight:   300g                                         Weight: Appox. 150Kgs

Machine dimension: L850×W700×H950mm

Hot air head and mounting head are designed 2 in 1, driven by servo motor, and have both the auto soldering and mounting function; can store 200 groups of different BGA heating points and register marks;

Color optical system with functions of split vision, zoom - in and micro-adjustment, equipped  with aberration              detection device; with auto focus and software operation function,22X optical zoom; able to rework BGA sized up to 70mm×70mm;

Touch screen interface, PLC control; able to display temperature curves and five detecting curves at the same time;

Color LCD monitor;

Built-in vacuum pump; 360° rotation in Φ angle; mounting nozzle is micro-adjustable;

6 segments of temperature up (down) and 6 segments constant temperature control, 200  groups of temperature curve are stored; Curve analysis can be carried out on the touch  screen and has the communication function as computers ,with software attached;

Able to arrive at three independent temperature zones,temperature and time can be displayed digitally on the touch screen; able to rework CGA;

The supports rack can be adjusted to restrain the local sinkage of the BGA soldering area;

Suction nozzle can identify material and mounting height automatically, and can control the air pressure within a small range of 30g-50g;

Heaters can be moved in any location within the working area to fit for reworking BGA in different positions on PCB;

Can be controlled independently through external computer, finished profile analysis, save, print;

Finished the BGA rework process under the nitrogen protection, have special function for save nitrogen to save cost;

Have the function for over-heating protection;

Large IR area heater from the bottom will heat the PCB evenly to avoid deformation and keep soldering effect; heating board is independent controlled;

Equipped with different alloy hot air nozzles, easy to replace and able to locate in any angle.

Can rework all types of CSP, BGA, CGA;  handle 775 socket, 478 socket, XBOX360, PS2/3 etc.